ГОСТ ISO/TS 80004-8—2016
natural lithography
7.1.19
NIL
7.1.18
optical lithography
7.1.20
7.1.21
7.3.16
7.1.20
6.2.3
7.3.17
7.2.14
7.3.18
6.2.
1.2
7.1.22
7.2.15
6.5.12
phase-contrast photolithography
photochemical etching
photolithography
photothermal synthesis
physical etching
physical vapour deposition
plasma etching
plasma spray
plasmonic lithography
polyelectrolyte layer-by-layer
polymer nanoparticle dispersion
prompt inorganic condensation
PVD
pyrogenesis
radiation track etching
reactive ion etching
reverse micelle process
RIE
SAM formation
scanning force probe writing
scanning tunneling microscope chemical vapour deposition
selective etching
self-assembled monolayer formation
self-assembly
shape-based assembly
soft lithography
sol-gel processing
solution precursor plasma spray
spark plasma sintering
spin coating
spray deposition
spray drying
sputter deposition
sputter etching
STMCVD
Stober process
Stranski — Krastanow growth
subtractive processing
supercritical expansion
supramolecular assembly
surface functionalization
6.4.3
7.2.14
6.2.1.3
7.3.19
7.3.20
6.4.4
7.3.20
5.8
7.1.23
7.1.24
7.3.21
5.8
3.11
4.5
7.1.25
6.4.5
6.2.1.4
6.5.13.3
7.2.17
7.2.18
6.1.4.2
7.2.19
7.3.17
7.1.24
6.4.7
5.9
7.1.27
6.1.5
4.6
3.12
30