ГОСТ ISO/TS 80004-8—2016
directed assembly
3.4
directed self-assembly
3.5
DRIE
7.3.7
dry-ashing
7.3.8
65.9.2
7.3.9
7.1.5
dry ball milling
dry-etching
DUV
electron-beam evaporation
electron-beam lithography
electrochemical anodization
electrodeposition
electroless deposition
electroplating
electro-spark deposition
electrospinning
electro-spray
electrostatic driven assembly
embossing
EUV
evaporation
extreme ultraviolet lithography
FIB
FIB
FIB
fluidic alignment
focused electron-beam deposition
focused ion-beam deposition
focused ion-beam etching
focused ion-beam lithography
freeze drying
graphioepitaxy
grinding
hierarchical assembly
high-density plasma etching
high-speed micromachining
hot pressing
hot wall tubular reaction
ICP
immersion optics
imprinting
inductive coupled plasma
in-situ intercalative polymerization
intercalation
interference lithography
6.1.2
7.1.7
6.6.2
7.2.7
7.2.8
7.2.7
6.1.3.1
6.3.1
7.2.9
4.1
7.4.1
7.1.8
7.2.10
7.1.8
7.1.9
7.2.12
7.3.10
4.2
7.2.11
7.2.12
7.3.10
7.1.9
6.1.4.1
5.2
6.5.6
4.3
7.3.11
6.5.7
6.5.13.1
6.2.2
7.3.12
7.1.10
7.4.1
7.3.12
6.3.2
6.6.3
7.1.11
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